 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0v3Nrw-0000VnC; Wed, 18 Sep 96 09:44 CDT |
| Old-Return-Path: |
|
| Date: |
Wed, 18 Sep 1996 10:53:20 -0400 |
| Precedence: |
list |
| X-Loop: |
|
| Message-ID: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| From [log in to unmask] Wed Sep 18 10: |
32:38 1996 |
| Resent-Message-ID: |
<"MyT0c1.0.ir8.Yh0Go"@ipc> |
| Subject: |
|
| From: |
|
| Resent-From: |
|
| Resent-Sender: |
|
| Parts/Attachments: |
|
|
Technetters
In the mid 1970's Paul Davis of Tin Research wrote an article on dewetting as
result of pumice scrub. Does anyone have a reference to where this was
published. Also does anyone have any input as to dewetting as result of
pumice scrub in relation to a sequence of: (1) pumice scrub, (2)apply solder
mask, (3) hot air level, (4)solderability test and dewet..
Another question on dewetting. Has anybody seen dewetting as a result of a
white residue on the lands and board which was analyzed as lead carbonate?
And another:where does the lead carbonate come ?
Phil Hinton
Hinton PWB Engineering
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
