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November 2006

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TechNet <[log in to unmask]>
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Date:
Wed, 15 Nov 2006 15:31:04 -0500
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TechNet E-Mail Forum <[log in to unmask]>, Vladimir Igoshev <[log in to unmask]>
Subject:
Re: Separation in BGA joints
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Vladimir Igoshev <[log in to unmask]>
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If the melting point is 270 C, as you checked then I completely agree.



Regards,



Vladimir



-----Original Message-----

From: [log in to unmask]

To: Vladimir Igoshev; [log in to unmask]

Sent: Wed Nov 15 15:20:53 2006

Subject: Re: [TN] Separation in BGA joints



Hi Vladimir,

Certainly, more solder paste would have helped; but IMHO is is still the temperature being too low.







Werner

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