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From: | "Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc> |
Date: | Tue, 12 Dec 95 19:03:01 -0500 |
Content-Type: | text/plain |
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Does anyone have any data on replacing the tin/lead finish on Teflon
boards with an organic solderability preservative (OSP)? Specifically,
how would the coating effect signal performance on an RF circuit?
Thanks in advance...
Jim Marsico
AIL Systems, Inc.
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