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| From [log in to unmask] Mon Jan 27 10: |
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Neil,
IPC has recently developed (through joint committee action with JEDEC)
the J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic
Integrated Circuit Surface Mount Devices.
This document does not cover the handling procedures. You can still use
the IPC-SM-786, rev. A, until the IPC & JEDEC committees develop a new
document to cover this.
If you have any questions, please call me at 847/509-9700, x393. Or you can
call JEDEC, Ms. Ingrid Taylor. They have two separate, existing
documents that cover the classification (JESD22-A112, now superseded by
J-020) and another document (JESD ???) that covers handling. Ingrid can
give you more details faster than I can. Ingrid Taylor 703/907-7560,
email [log in to unmask]
On Fri, 24 Jan 1997, Neil W. Lareau wrote:
>
> We are looking for literature on reliability issues and failure modes of
> plastic packages (non-hermetic). Can you steer us toward any IPC
> literature on that issue?
>
> Thanks.
>
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