Dear Technet: 
 
I was reading a recent Circuit World edition about Alpha Metal's
silver/organic stabilizer coating and Motorola's tin/bismuth coating. 
 
One difference was wire bondability. 
 
(1) Are these in use anywhere? 
(2) Is there a waste treatment/safety preference? 
(3) The eutectic temperature for tin/bismuth is lower than solder.  Are
there any problems there? 
(4)  Does anyone believe these to be analogous to early IBM and
Commodore home systems (i.e., will only one make it)?  Which will the
customer demand? 
 
and 
(5)  Does anyone have some real world contacts from either camp? 
 
Thank you, I look forward to the response to my first question!  
 
Mike

Mike Smith 
Material Sciences student, University of Wisconsin

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