Dear Technet: I was reading a recent Circuit World edition about Alpha Metal's silver/organic stabilizer coating and Motorola's tin/bismuth coating. One difference was wire bondability. (1) Are these in use anywhere? (2) Is there a waste treatment/safety preference? (3) The eutectic temperature for tin/bismuth is lower than solder. Are there any problems there? (4) Does anyone believe these to be analogous to early IBM and Commodore home systems (i.e., will only one make it)? Which will the customer demand? and (5) Does anyone have some real world contacts from either camp? Thank you, I look forward to the response to my first question! Mike Mike Smith Material Sciences student, University of Wisconsin *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************