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May 2002

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Subject:
Vias-in-pads
From:
Denis Lefebvre <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 7 May 2002 12:15:40 -0700
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One of my co-workers has been handed a 'reverse-engineering' project that was done by an outside contractor. There are BGA's on this board that have had vias placed directly in the solder land as well as many other SMD's with vias dropped in the solderable land area. 
 
It has always been my belief that this is not a good "DFM" practice. Just wondering if anyone out there has had any experience or information on via-in-pad techniques - especially on BGA's.
 
Denis Lefebvre, C.I.D.
Senior PCB Designer
408-542-3832
Finisar Corporation
1308 Moffett Park Drive
Sunnyvale, CA 94086
www.finisar.com <http://www.finisar.com/> 
 

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