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Content-type:	text/plain; charset=us-ascii
Sender:	TechNet <[log in to unmask]>
Subject:	Re: DI water and aluminum bond pads
From:	Douglas Pauls <[log in to unmask]>
Date:	Fri, 2 Feb 2001 16:07:44 -0600
MIME-Version:	1.0
X-To:	"Mikell, Steve" <[log in to unmask]>
Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:	text/plain (21 lines)

Mike brings up some good points, but I should be more specific.  We are
talking about the bonding of wires (e.g. wedge bonding or ball bonding) to
the affected pads, not adhesive or organic material bonding.  Can the high
purity DI water be changing the characteristics of the pad such that I get
poor bonding between the wire and the pad.

Doug Pauls
Rockwell Collins

P.S.  Yes, the new job is everything I hoped for.

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