Mike brings up some good points, but I should be more specific. We are talking about the bonding of wires (e.g. wedge bonding or ball bonding) to the affected pads, not adhesive or organic material bonding. Can the high purity DI water be changing the characteristics of the pad such that I get poor bonding between the wire and the pad. Doug Pauls Rockwell Collins P.S. Yes, the new job is everything I hoped for. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------