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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 11 Aug 2003 15:03:46 -0700 |
Content-Type: | multipart/alternative |
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Ted,
Is the package warping slightly and the corners turning downward? Is the
solder mask damaged at the corners due to the cleaning process? Also,
sometimes I have noticed that BGA replacement using a hot air rework station
results in a lower package stand off distance if solder paste is not used
(and possibly due to the slight downward hot air pressure pushing the
package down).
joe
-----Original Message-----
From: Ted Kong [mailto:[log in to unmask]]
Sent: Monday, August 11, 2003 2:54 PM
To: [log in to unmask]
Subject: [TN] BGA bridging on corner pins only
Hi All at Technet Land,
Can someone explan why do I see bridgings only on the
corner pins during rework? The package is a 1517 Pin
BGA and the rework was done on the SRT rework station
with only flux (No paste). When I run the same board
and component through the reflow oven, I see no
bridging. I tried lower the air flow and increase the
spacing between the board and the chimney, but neither
helped. Any input is greatly appreciated.
Thanks all in advance.
Ted Kong
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