Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 4 Apr 2003 13:39:33 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Fellow Wizards,
Occasionally, I am asked to reflow BGAs already placed because tests
suspects a solder problem. Sometimes reflowing does fix suspected problems
so who can argue.
We have a AIR VAC DRS-24 BGA rework station which has worked very well. I
have been using Kester's TSF-6522 tacky flux for new placements and liquid
RMA for reflows. Reflows require getting flux under a BGA which is not easy
for the larger packages.
What I would like to know is what type of tacky flux is commonly used by my
colleagues for new BGA placements, and what type of flux is commonly used
when a reflow is required? What is the success rate for reflows?
Look forward to hearing from ......... thanks
joe
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|