Fellow Wizards, Occasionally, I am asked to reflow BGAs already placed because tests suspects a solder problem. Sometimes reflowing does fix suspected problems so who can argue. We have a AIR VAC DRS-24 BGA rework station which has worked very well. I have been using Kester's TSF-6522 tacky flux for new placements and liquid RMA for reflows. Reflows require getting flux under a BGA which is not easy for the larger packages. What I would like to know is what type of tacky flux is commonly used by my colleagues for new BGA placements, and what type of flux is commonly used when a reflow is required? What is the success rate for reflows? Look forward to hearing from ......... thanks joe --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------