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Fwd: Assy: Intrusive Reflow techniques
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>From bergdi Wed May 7 20:
42:14 1997
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A couple of pointers:

Circuits Assembly Magazine October 95 -   Developing the Paste in Hole 
Process

Also AMP connectors had a paper on the subject at http://connect.amp.com


Ron Wedemeyer
Senior Engineer - Product Engineering
QPSX Communications Pty Ltd
[log in to unmask]


         *************** ORIGINAL MESSAGE FOLLOWS *****************

Hey Techies,
I know someone out there has my answers.
I read a recent posting pertaining to a technique described as 
Intrusive reflow.  This is a process of reflow soldering thru hole 
components.  From a design for manufacturability view what do we need 
to do special in our design to take advantage for this technique.

Does the board require any special layout ?

Do I need to modify the solder paste layer output ?

What other considerations need to be taken into account in order to 
add one or two components to a surface mount board with out adding 
extra costs and subsequent processes.

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