A couple of pointers: Circuits Assembly Magazine October 95 - Developing the Paste in Hole Process Also AMP connectors had a paper on the subject at http://connect.amp.com Ron Wedemeyer Senior Engineer - Product Engineering QPSX Communications Pty Ltd [log in to unmask] *************** ORIGINAL MESSAGE FOLLOWS ***************** Hey Techies, I know someone out there has my answers. I read a recent posting pertaining to a technique described as Intrusive reflow. This is a process of reflow soldering thru hole components. From a design for manufacturability view what do we need to do special in our design to take advantage for this technique. Does the board require any special layout ? Do I need to modify the solder paste layer output ? What other considerations need to be taken into account in order to add one or two components to a surface mount board with out adding extra costs and subsequent processes. ************************************************************************** * * TechNet mail list is provided as a service by IPC using SmartList v3.05 * ************************************************************************** * * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * ************************************************************************** * * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ************************************************************************** * *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************