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August 1999

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Subject:
Solder paste on Test Point
From:
Nick Nicolaides <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 25 Aug 1999 14:58:55 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines) 
On double reflow boards our ICT test engineers now want to solder paste the
solder side test points prior to reflow. We do not see any advantage to this
but about 2000 more holes in the stencil. What are your ICT people saying.

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