If they're OCC/OSP boards, they want to make contact without going through
the goo. Is this the case? If so, get them some rotating test pins to
"drill" through the residue.

Earl Moon
----- Original Message -----
From: Nick Nicolaides <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 25, 1999 11:58 AM
Subject: [TN] Solder paste on Test Point


> On double reflow boards our ICT test engineers now want to solder paste
the
> solder side test points prior to reflow. We do not see any advantage to
this
> but about 2000 more holes in the stencil. What are your ICT people saying.
>
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