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November 1998

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Sender:
TechNet <[log in to unmask]>
Date:
Tue, 10 Nov 1998 11:19:38 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Benedicto Cruz <[log in to unmask]>
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Subject:
solder paste inquery
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1.0
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From:
Benedicto Cruz <[log in to unmask]>
Comments:
Authenticated sender is <bcruz@[192.1.1.215]>
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text/plain (29 lines) 
Hi netters,

I would like to inquire if there is a matrix that we can follow
regarding the solder paste volume requirement versus the component
size. We need this in our stencil design procedure.
This is to have an idea on the needed considerations during designing
stencils.
A quick response is high appreciated.


Jon Cruz
Supervising Product Engineer
Electronic Assemblies Inc.
[log in to unmask]
tel.# 823-7317/7593884
fax# 8238326

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