Hi netters, I would like to inquire if there is a matrix that we can follow regarding the solder paste volume requirement versus the component size. We need this in our stencil design procedure. This is to have an idea on the needed considerations during designing stencils. A quick response is high appreciated. Jon Cruz Supervising Product Engineer Electronic Assemblies Inc. [log in to unmask] tel.# 823-7317/7593884 fax# 8238326 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################