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September 2000

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TechNet <[log in to unmask]>
Subject:
Etch factor and 3 OZ copper foil
From:
Shirley Xiao <[log in to unmask]>
Date:
Fri, 29 Sep 2000 01:28:00 -0700
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"TechNet E-Mail Forum." <[log in to unmask]>, Shirley Xiao <[log in to unmask]>
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Dear Technetters:
  Does anyone has experience to get 7 mil/7mil line
width/gap out of 3 OZ copper foil by inner layer
etching (CuCl2, HCL, H2O2)? Is there any concerns
about undercut or peel strength?
 How about the etch factor for CuCl2 etching? Can we
get 3?

Thanks and best regards
Shirley



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