Dear Technetters:
  Does anyone has experience to get 7 mil/7mil line
width/gap out of 3 OZ copper foil by inner layer
etching (CuCl2, HCL, H2O2)? Is there any concerns
about undercut or peel strength?
 How about the etch factor for CuCl2 etching? Can we
get 3?

Thanks and best regards
Shirley



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