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| From [log in to unmask] Thu Mar 27 12: |
37:46 1997 |
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The current revision of this spec is NHB5300.4(3A-2) (January 92)
We are using an aquious cleaner for all the boards we clean here, but we
don't have much volume & hand solder most (I think actualy all) our boards.
We are working under the 3A-2 (and 3G-1,3H,3J...)
We use mostly watersoluble fluxes, except for hand solder & rework.
All boards are cleaned with the aquious cleaner. I believe we check
with an omegameter. The initial work thru for NASA we tested the water
sepprately for contaminits. We also wrote a suppliment (approved by GSFC)
to the 3A-2 to clarify certian aspects of the spec & define allowable conditions
(white residue after cleaning, lead overhang, ect ~9pages) this was a long
process, but well worth it when it's time to submit material to the customer.
Bill Gaines
AeroJet
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