The current revision of this spec is NHB5300.4(3A-2) (January 92) We are using an aquious cleaner for all the boards we clean here, but we don't have much volume & hand solder most (I think actualy all) our boards. We are working under the 3A-2 (and 3G-1,3H,3J...) We use mostly watersoluble fluxes, except for hand solder & rework. All boards are cleaned with the aquious cleaner. I believe we check with an omegameter. The initial work thru for NASA we tested the water sepprately for contaminits. We also wrote a suppliment (approved by GSFC) to the 3A-2 to clarify certian aspects of the spec & define allowable conditions (white residue after cleaning, lead overhang, ect ~9pages) this was a long process, but well worth it when it's time to submit material to the customer. Bill Gaines AeroJet *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************