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August 1997

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TechNet Mail Forum<[log in to unmask]>
Subject:
BGA Solder Ball Migration
From:
Dennis Fall <[log in to unmask]>
Date:
Fri, 29 Aug 1997 12:39:04 -0500
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"TechNet Mail Forum." <[log in to unmask]>, Dennis Fall <[log in to unmask]>
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Hi-
I was wondering what might cause solder balls to "merge" together during
reflow?

--
Dennis Fall

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