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August 1997

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TechNet Mail Forum<[log in to unmask]>
Subject:
Re: BGA Solder Ball Migration
From:
Viswanath Valluri <[log in to unmask]>
Date:
Fri, 29 Aug 1997 10:59:11 -0700
In-Reply-To:
<"0829175441-TECHNET BGA Solder Ball Migration"* @MHS>
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"TechNet Mail Forum." <[log in to unmask]>, [log in to unmask]
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Hi :

There could be several reasons for this.  The maximum temperature  reached,
time above 183 C , handling of trays, any air flow in the reflow chamber.
All these contributed significantly to the "merging of solder balls".

Regards

Vis Valluri

---- TechNet(a)IPC.ORG's Message ----

Hi-
I was wondering what might cause solder balls to "merge" together during
reflow?

--
Dennis Fall

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