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Date: | Wed, 7 Oct 2009 07:19:57 -0500 |
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Just out of curiosity, when you detect an open on a BGA, what do you do? I'm
suspecting it is not practical to rework just the open sj, can you reflow the
entire BGA to get the open sj to form a connection, or remove and reattach?
Do you re-use the removed device or replace with a new one?
Is the x-ray inspection really useful, or is it just to confirm a defect found in
test? Or does it detect defects before test so that they can be reworked prior
to testing?
Is the x-ray inspection useful for getting the profile parameters correct, and
then once the process is in control the inspection no longer adds value?
Thanks,
Blair
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