Congratulations Werner
----- Original Message -----
From: Joe Fjelstad
To: [log in to unmask]
Sent: Tuesday, October 14, 2003 8:42 PM
Subject: [TN] Congratulations Werner!
For those who might have missed it
“Mr. Reliability” Awarded IPC’s 2003 Hall of Fame Award
NORTHBROOK, Ill., October 7, 2003--IPC—Association Connecting Electronics Industries® recently honored Werner Engelmaier, Engelmaier Associates, L.C., with the 2003 Raymond E. Pritchard IPC Hall of Fame Award at the 2003 IPC Annual Meeting in Minneapolis, Minn.
Based on exceptional lifetime achievement, the Raymond E. Pritchard IPC Hall of Fame Award is IPC’s highest level of recognition, honoring members who make extraordinary contributions to IPC and the electronic interconnection industry.
Known as “Mr. Reliability” in the industry for his vast experience in product reliability, Werner Engelmaier was selected as this year’s recipient for his dedicated service and outstanding industry contributions over the past three decades.
A founder and current chairman of the IPC Product Reliability Committee, Engelmaier also currently chairs the IPC Accelerated Reliability Testing Subcommittee and serves as vice-chair of both the IPC Plated-Through Hole/Via Reliability and the IPC Plated-Through Hole/Via Post Separation Task Groups.
A past chairman of the IPC Metal/Copper Foil Committee, Engelmaier has been an active member of IPC technical committees on flex circuits, molded printed boards, surface mount land patterns, soldering, test methods, and the Technical Activities Executive Committee.
Over the years, he has substantially contributed to more than 20 IPC standards and documents and has represented the reliability point of view in many others. Engelmaier has published over 145 technical papers and columns and contributes to IPC’s TechNet and Lead Free Forums.
Apart from his service to IPC, Engelmaier has served on an IEEE task force; become a director of the International Electronics Packaging Society; chaired two subcommittees and a testing committee for the American Society of Testing Material; and become a life member of the American Society of Mechanical Engineers, the International Microelectronics and Packaging Society. He also was issued two patents and became a Distinguished Member of the Technical Staff while employed at Bell Labs.
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