----- Original Message -----
Sent: Tuesday, October 14, 2003 8:42
PM
Subject: [TN] Congratulations
Werner!
For those who might
have missed it
“Mr. Reliability” Awarded IPC’s 2003 Hall of Fame
Award
NORTHBROOK, Ill., October 7, 2003--IPC—Association Connecting
Electronics Industries® recently honored Werner Engelmaier, Engelmaier
Associates, L.C., with the 2003 Raymond E. Pritchard IPC Hall of Fame Award at
the 2003 IPC Annual Meeting in Minneapolis, Minn.
Based on exceptional
lifetime achievement, the Raymond E. Pritchard IPC Hall of Fame Award is IPC’s
highest level of recognition, honoring members who make extraordinary
contributions to IPC and the electronic interconnection industry.
Known as
“Mr. Reliability” in the industry for his vast experience in product
reliability, Werner Engelmaier was selected as this year’s recipient for his
dedicated service and outstanding industry contributions over the past three
decades.
A founder and current chairman of the IPC Product Reliability
Committee, Engelmaier also currently chairs the IPC Accelerated Reliability
Testing Subcommittee and serves as vice-chair of both the IPC Plated-Through
Hole/Via Reliability and the IPC Plated-Through Hole/Via Post Separation Task
Groups.
A past chairman of the IPC Metal/Copper Foil Committee, Engelmaier
has been an active member of IPC technical committees on flex circuits, molded
printed boards, surface mount land patterns, soldering, test methods, and the
Technical Activities Executive Committee.
Over the years, he has
substantially contributed to more than 20 IPC standards and documents and has
represented the reliability point of view in many others. Engelmaier has
published over 145 technical papers and columns and contributes to IPC’s
TechNet and Lead Free Forums.
Apart from his service to IPC, Engelmaier has
served on an IEEE task force; become a director of the International
Electronics Packaging Society; chaired two subcommittees and a testing
committee for the American Society of Testing Material; and become a life
member of the American Society of Mechanical Engineers, the International
Microelectronics and Packaging Society. He also was issued two patents and
became a Distinguished Member of the Technical Staff while employed at Bell
Labs.
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