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Thu, 26 Aug 1999 13:55:19 +0200 |
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Hi Werner,
Are you referring to the differing thermal coefficients contributing to
unreliability?
-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Thursday, August 26, 1999 6:02 AM
To: [log in to unmask]
Subject: Re: [TN] Advice on solder pad design
Hi Eric,
Get a copy of IPC-SM-782.
But why are you considering LCCs (leadless ceramic chip carriers)? Are you
mounting them on ceramic? If you are using FR-4 or any other polymer-based
substrates you can forget about reliabilty in any environment other then a
really benign one, such as sub-ocean cable repeaters. You could of course
put
solder columns on the component.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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