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Hello Technetters!
My company has been manufacturing a PCMCIA ARCNET interface card (20 mil
pitch) for just over a year now, using screen printer technology. We have
been tuning our process consistantly, but we are still not happy about the
amount of rework needed. (About 15% are reworked in each run) We build in an
8-up panel (2x4)0.020 thick PCB. DeHaart screen printer, Mydata TP9-2 PnP,
and Vitronics convection reflow (natural atmosphere).
Lately I have received info about Solid Solder Deposit(SSD) technology,
in which the PCB panel is "pre-soldered" at the board house, and a "sticky"
paste flux applied just prior to assembly. The purveyors of this technology
are tooting their horns long and loud about registration, coplanerarity and
such, but I would like to know from techs who use it:
1. Does it work?
2. Is it cost effective?
3. Is there a "no-clean" sticky flux?
I would appreciate any insight that you could give me in this matter.
Neil Maloney
Contemporary Control Systems
www.ccontrol.com
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