Hello Technetters! My company has been manufacturing a PCMCIA ARCNET interface card (20 mil pitch) for just over a year now, using screen printer technology. We have been tuning our process consistantly, but we are still not happy about the amount of rework needed. (About 15% are reworked in each run) We build in an 8-up panel (2x4)0.020 thick PCB. DeHaart screen printer, Mydata TP9-2 PnP, and Vitronics convection reflow (natural atmosphere). Lately I have received info about Solid Solder Deposit(SSD) technology, in which the PCB panel is "pre-soldered" at the board house, and a "sticky" paste flux applied just prior to assembly. The purveyors of this technology are tooting their horns long and loud about registration, coplanerarity and such, but I would like to know from techs who use it: 1. Does it work? 2. Is it cost effective? 3. Is there a "no-clean" sticky flux? I would appreciate any insight that you could give me in this matter. Neil Maloney Contemporary Control Systems www.ccontrol.com *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************