FYI
Alpha STAR(r)
High Performance Immersion Silver for
Lead-Free Soldering
Consistent reliability in a lead-free circuit board finish just reached
a new level
Includes Alpha STAR Results on Planar Micro void
Issued / Revised: Aug 25, 2006
Surface Finishes Market Trends:
Projected Global Growth and Changes in the Market: HASL 57%, OSP 20%,
ENIG 14%, ImSn 3% and ImAg 6%
Projected to be: HASL 37%, OSP 28%,
ENIG 14%, ImSn 4% and ImAg 17%
CAGR 2004 Global Finish Volume 2008 Global Finish Volume Board Sqft CAGR
HASL -4.4% OSP 14.5% ImAg 42% ImSn 22% ENIG 5.7%
Source: Internal, Prismark, IPC/TMRC*Immersion Silver and OSP will grow
at the expense of HASL and ENIG
*HASL will decline due to the non-uniform planarity, poor cleanliness,
high layer count yield loss, Pb-free cost increase, lack of Pb-free
process development, and industry support
*ENIG high priced contact finish niche will continue, but "Black
Pad"fear, assembler liability issues, and costs pressures will lead to
decline*Immersion
Tin growth is less clear, press fit preferred, but limited by
inconsistent shelf life, long process time, tin whisker fear and solder
mask compatibility
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