Hello Suganthi,
Joyce's suggestion is a good one. There are a number of other books on IC
packaging available as well.
"Electronic Packaging and Interconnection Handbook" by Charles A. Harper
"The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated
IC Packages" by Gerard Kelly
and on behalf of my coauthors and coeditors may I also suggest
"Chip Scale Packaging for Modern Electronics" by Fjelstad, Ghaffarian and
Kim
In addition there are also services offered by a number of IC packaging
companies. Below is a link to Amkor's Design Center.
_http://www.amkor.com/services/Design_Center/index.cfm_
(http://www.amkor.com/services/Design_Center/index.cfm)
Best wishes,
Joe
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