Hello Suganthi, Joyce's suggestion is a good one. There are a number of other books on IC packaging available as well. "Electronic Packaging and Interconnection Handbook" by Charles A. Harper "The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages" by Gerard Kelly and on behalf of my coauthors and coeditors may I also suggest "Chip Scale Packaging for Modern Electronics" by Fjelstad, Ghaffarian and Kim In addition there are also services offered by a number of IC packaging companies. Below is a link to Amkor's Design Center. _http://www.amkor.com/services/Design_Center/index.cfm_ (http://www.amkor.com/services/Design_Center/index.cfm) Best wishes, Joe --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------