bake is good.  standard for flex, especially, polyimide adhesive high  
rel, high temp version.  prevent delamination, solderability and get  
your reliability in a tight controlled curve (minimize random  
failure)... bake in nitrogen oven is better if you have one. money/ 
time well spend.
IMHO.
jk
On Jan 10, 2020, at 7:53 AM, Jerry Dengler wrote:

> TechNetters,
>
>
>
> We reviewed documentation from a flexible PCB manufacturer and saw  
> that
> they recommend baking of the flex boards prior to assembly even if  
> they
> are brand new boards in a Moisture Barrier Bag.
>
>
>
> Why wouldn't these be handled like any other moisture sensitive
> component?
>
>
>
> How many of you that work with flexible PCBs are baking them even if
> they come out of a MBB with A HIC card that shows no real moisture?
>
>
>
> Thank You,
>
>
>
> Jerry Dengler
>
> Production Manager
>
> Pergamon Corporation
>
> 380 Crooked Lane, Unit# 3
>
> King of Prussia, PA  19406-2567
>
> U.S.A.
>
> (610) 239-0721 Phone
>
>