>>> "Marsico, James" <[log in to unmask]> 09/17/01 07:51AM >>>

We've been struggling with solder beads recently, which, after an aggressive
aqueous cleaning, have been found under some chip capacitors.  We've
probably had this problem all along, but we just got a new inspector who
decided to look under components.  Anyway, Our SMT operator decided to do
some experimenting and added liquid flux to the solder paste (Why?  Beats
me!).  The water soluble flux he added is the same formulation as the flux
in the paste.  Low and behold, the solder beads seem to have been
significantly reduced.  The only explanation I can think of is that the
extra flux results in smaller beads which wash away and don't get stuck
under the components.  Any comments?   

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]> 
631-595-5879