>>> "Marsico, James" <[log in to unmask]> 09/17/01 07:51AM >>> We've been struggling with solder beads recently, which, after an aggressive aqueous cleaning, have been found under some chip capacitors. We've probably had this problem all along, but we just got a new inspector who decided to look under components. Anyway, Our SMT operator decided to do some experimenting and added liquid flux to the solder paste (Why? Beats me!). The water soluble flux he added is the same formulation as the flux in the paste. Low and behold, the solder beads seem to have been significantly reduced. The only explanation I can think of is that the extra flux results in smaller beads which wash away and don't get stuck under the components. Any comments? Jim Marsico Senior Engineer Production Engineering EDO Electronics Systems Group [log in to unmask] <mailto:[log in to unmask]> 631-595-5879