Hi folks! I am on a fishing exposition: I am looking for plated thru hole
thermal cycle reliability reports/papers. I have a ton (literally) of
surface mount technology investigations but we have just finished up a
leadfree wave solder alloy thermal cycle solder joint integrity
investigation and I am in search of published data sets so I can do a
results comparison. I do have the papers by C. Hamilton/Celestica which
are very good but I am in quest of additional report data sets. If you
know of any published reports, please drop me an email.
Thanks in advance.
Dave Hillman
Rockwell Collins
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