Subject: | |
From: | |
Reply To: | |
Date: | Thu, 23 Sep 2010 13:53:38 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Dave,
Does that line ever work? Is this to include PTHs that have components
and were soldered by you or Doug?
Do you want Lead-free or eutectic as the final finish and reflowed in a
eutectic, mixed metallurgy or Lead-free processing medium?
IPC EXPO 2006 this was presented "Reliability of Partially Filled SAC305
Through-Hole Joints".
I am slowly putting a white paper together for an IPC Handbook for
Lead-free Assembly. Many papers so far but no organization or search
capability yet.
If you could be more specific I may have a few more right now.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Thursday, September 23, 2010 9:31 AM
To: [log in to unmask]
Subject: [TN] Leadfree Plated Thru Hole Thermal Cycle Reliability Paper
Hunt
Hi folks! I am on a fishing exposition: I am looking for plated thru
hole
thermal cycle reliability reports/papers. I have a ton (literally) of
surface mount technology investigations but we have just finished up a
leadfree wave solder alloy thermal cycle solder joint integrity
investigation and I am in search of published data sets so I can do a
results comparison. I do have the papers by C. Hamilton/Celestica which
are very good but I am in quest of additional report data sets. If you
know of any published reports, please drop me an email.
Thanks in advance.
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or
[log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|