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by ipc.org (Smail3.1.28.1 #2)
id m0wtZgm-000BkKC; Wed, 30 Jul 97 09:25 CDT |
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| >From willli Wed Jul 30 09: |
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| From [log in to unmask] Thu Jul 31 12: |
07:14 1997 |
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Does anybody have a specification for these particular topics :
- Time allowed between water soluble paste printing and reflow ?
- Time allowed between reflowed PCB assembled with waters soluble solder
paste and the cleaning operation ?
Is there a different specification between the different types or activity
of organic fluxes? If it so, what is it? Is it a problem if we double
reflow th PCB (double sided board) before the cleaning? Depending on the
quantity of a giving lot, the time between the first printing and the
cleaning operation may be long (see couple of hours, the cleaning machine
is not in line with the SMT machines), that why I'm interested to know if
there is a spec.
Also, does anybody have a specification for the baking operation to prevent
or eliminate moisture in plastic components (IC, QFP, BGA, etc...). Is
there a relationship between the exposure time in humidity vs baking time
or is there a fixed set of temperature and time parameters?
Thanks in advance, it would be very appreciated if someone could share any
specification or recommendation.
-------------------------------------------------
Patrick Ducas
Process Quality Engineer
Matrox Electronic Systems Ltd
E-mail: [log in to unmask]
Tél:(514)969-6000 ext.2971 Fax:(514)685-3415
-------------------------------------------------
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