Does anybody have a specification for these particular topics : - Time allowed between water soluble paste printing and reflow ? - Time allowed between reflowed PCB assembled with waters soluble solder paste and the cleaning operation ? Is there a different specification between the different types or activity of organic fluxes? If it so, what is it? Is it a problem if we double reflow th PCB (double sided board) before the cleaning? Depending on the quantity of a giving lot, the time between the first printing and the cleaning operation may be long (see couple of hours, the cleaning machine is not in line with the SMT machines), that why I'm interested to know if there is a spec. Also, does anybody have a specification for the baking operation to prevent or eliminate moisture in plastic components (IC, QFP, BGA, etc...). Is there a relationship between the exposure time in humidity vs baking time or is there a fixed set of temperature and time parameters? Thanks in advance, it would be very appreciated if someone could share any specification or recommendation. ------------------------------------------------- Patrick Ducas Process Quality Engineer Matrox Electronic Systems Ltd E-mail: [log in to unmask] Tél:(514)969-6000 ext.2971 Fax:(514)685-3415 ------------------------------------------------- *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************