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May 2002

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Subject:
From:
Denis Lefebvre <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 23 May 2002 07:09:38 -0700
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Technet;
As a designer, I diligently try to understand and account for fabrication and assembly issues in my designs. It can be frustrating when working with EE's that are not well versed in manufacturing as they request things that you know are not good practice from a DFM viewpoint. 
I have a case now where an EE is asking for a copper fill on BGA ground pins. Since this is not easy to describe in a way that every one can understand, I am including a small JPG to illustrate. It is a 356 pin BGA, 1mm pitch, 0.5mm solder lands. 

I am convinced that this will not fare well when they try to solder this part, yet the engineer insists on doing it this way. What argument can I make, with supporting data, to persuade him? Simply telling him that I know it is poor practice isn't cutting it! [Adjusting tie..."I tell ya, we get no respect!"]
 
 
Denis Lefebvre, C.I.D.
Senior PCB Designer
408-542-3832
Finisar Corporation
1308 Moffett Park Drive
Sunnyvale, CA 94086
www.finisar.com <http://www.finisar.com/> 
 



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