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December 1998

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TechNet <[log in to unmask]>
Subject:
Re: FAB: Solder Filled Thermal Vias
From:
KELLY M SCHRIVER <[log in to unmask]>
Date:
Tue, 8 Dec 1998 11:43:00 -0500
X-To:
John Parsons <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, KELLY M SCHRIVER <[log in to unmask]>
Parts/Attachments:
text/plain (25 lines) 
Hi John -

Experience with solder filled vias: the solder reflows during assembly
soldering operations.  Invariably it will reconfigure itself into something
you don't really want, particularly in those vias located under component
bodies.  Recommend you consider a filler which will not melt at assembly
process temperatures.

TechNet archives will show a number of comments on this subject back in the
August or September '98 time frame.

Regards - Kelly

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