Hi John - Experience with solder filled vias: the solder reflows during assembly soldering operations. Invariably it will reconfigure itself into something you don't really want, particularly in those vias located under component bodies. Recommend you consider a filler which will not melt at assembly process temperatures. TechNet archives will show a number of comments on this subject back in the August or September '98 time frame. Regards - Kelly ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################