Hi John -

Experience with solder filled vias: the solder reflows during assembly
soldering operations.  Invariably it will reconfigure itself into something
you don't really want, particularly in those vias located under component
bodies.  Recommend you consider a filler which will not melt at assembly
process temperatures.

TechNet archives will show a number of comments on this subject back in the
August or September '98 time frame.

Regards - Kelly

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