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January 2002

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"Blomberg, Rainer (FL51)" <[log in to unmask]>
Date:
Tue, 8 Jan 2002 13:59:40 -0500
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Hans,

We do Hi-Rel Space application, low outgassing and do most of our
bonding/staking with the following semi-rigid modified epoxy.

Scotchweld 2216, Gray

3211 East Chestnut Expressway

Springfield, Missouri 65802

It can cure at RT or 1 hr at 200 deg.F, works easily, size and location of
application can be controlled (does not run).  We coat right over it.  It's
resistant to most solvents but is temporarily softened on long-term exposure
to Axarel 32.  We go to Mechanical staking when the components are very
large (>.250" dia.)

.Rainer G. Blomberg
Honeywell -Space Systems Clearwater
Staff Production Engineer
13350 US Hwy 19 N MS 802-3
Clearwater, FL 33764-7290
(727) 539-5534 Phone
(727) 790-8738 Pager
(727) 539-4469 Fax
e-mail: [log in to unmask]




 -----Original Message-----
From: Hinners Hans M Civ WRALC/LUGE [mailto:[log in to unmask]]
Sent: Tuesday, January 08, 2002 9:44 AM
To: [log in to unmask]
Subject: Re: [TN] Staking compounds


Hi All,

This is great information.  I've had an Assembly supplier suggest using an
RTV to stake discrete components to FR-4.  Graham confirmed that it wasn't a
good combination with a silicone based conformal coating.  (Thanks Graham.)
The last thing I or the customer needs is dewetting of the conformal
coating.  My applications are hi-rel military avionics - in a rather harsh
environment: high vibration, high humidity and some salt water.

Is there some cutoff point when it's better to go with mechanical staking?
I'm new to staking.

Hans

Integrity First  -  Service Before Self  -  Excellence in All We Do
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Electronics Engineer
Warner Robins - Air Logistics Center (WR-ALC/LUGE)
226 Cochran Street
Robins AFB GA 31098-1622

mailto:[log in to unmask] <mailto:[log in to unmask]>

Com: (478) 926 - 5224
Fax:   (478) 926 - 4911
DSN Prefix: 468


-----Original Message-----
From: Dieselberg, Ron [mailto:[log in to unmask]]
Sent: Tuesday, January 08, 2002 7:28 AM
To: [log in to unmask]
Subject: Re: [TN] Staking compounds



Doug, we have used CONAP K-20 for a long time with good results. We have
also used Loctite 416 with 18580 activator. The Loctite is easier to use
since it "sets" more quickly.

All depends on how you want to use it and how much time you have available
for curing.
In either case be sure the materials that you are going to stake to are
"sqweekey" clean!

Ron Dieselberg
Trainer/Auditor
CMC ELECTRONICS
CINCINNATI
[log in to unmask]

        BM__MailData-----Original Message-----
From:   [log in to unmask] [ mailto:[log in to unmask]
<mailto:[log in to unmask]> ]
Sent:   Monday, January 07, 2002 14:41 PM
To:     [log in to unmask]
Subject:        [TN] Staking compounds

        Good day all,

        I am curious as to what all y'all use for staking compounds (to fix
wires
or components in place) on your assemblies, especially if you are in the
high-rel area or aerospace sector.  Thanks.

        Doug Pauls
Rockwell Collins



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