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Sun, 23 Dec 2001 11:48:30 -0800 |
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Technetters...
I have been reading the suggestions about how one
verifies that laminate layers are stacked correctly.
Did you know that a company, Samsung, has actually
"patented" the idea of using offset metal pads near
the edges of the substrate to determine that the
layup is correct.
No way! Yes way! - patent number 6,091,026 (I saw the
patent reviewed in Chip Scale Design Magazine...November
December 2001, page 57)
So all of you using the technique - send your money
to Samsung! And I though that patents had to be non-obvious
to those skilled in the industry ...
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Steve DiBartolomeo [log in to unmask]
PC Tools Microelectronics Tools
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