Technetters... I have been reading the suggestions about how one verifies that laminate layers are stacked correctly. Did you know that a company, Samsung, has actually "patented" the idea of using offset metal pads near the edges of the substrate to determine that the layup is correct. No way! Yes way! - patent number 6,091,026 (I saw the patent reviewed in Chip Scale Design Magazine...November December 2001, page 57) So all of you using the technique - send your money to Samsung! And I though that patents had to be non-obvious to those skilled in the industry ... ======================================================== Steve DiBartolomeo [log in to unmask] PC Tools Microelectronics Tools --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------