Thanks Steve,
I have had one complaint that the nickel is too rough - looks like surface
co-planarity is +/-  2 microns which too me is nothing and from further
analysis follows the contour of the copper underneath which easily meets
the IPC spec - should this cause an issue? Regards Steve

On 2015-01-19, 11:56 AM, "Steven Creswick" <[log in to unmask]>
wrote:

>Steve,
>
>The short answer is not too much.
>
>You should be able to develop a robust bond schedule to the ENEPIG (but I
>guarantee you that it will be at least somewhat different than your bond
>schedule to soft gold).  Under no circumstances should you assume that it
>is
>a plug and play alternate.
>
>You should not have to spec any differences in wire properties.
>
>You may look into changing the face angle of your capillary and inner
>chamfer as part of your qualification testing.  Depending upon your
>current
>bonding tool, you may also take a look at increasing the outer radius of
>the
>tool.
>
>ENEPIG is 'hard' in comparison to pure soft gold, so if currently running
>with a 15° face angle, look at 8°.  If you have problems with tail
>formation, you may look into a 120° inner chamfer instead of a 90°.  If
>you
>are getting a lot of heel breaks at the second bond, increase the outer
>radius ..... all stuff you most likely are already looking into.
>
>Final comments - ENEPIG is not totally without issues.  Some days, some
>lots, just plain sucked!  There is no other way to say it.  Get a reliable
>plater.  Work with them.  Stay with them.  Don't let accounting take you
>to
>the cheapest place in town - you will regret the grief you will have.
>
>NOTHING bonds like clean, pure, soft gold!!!  It IS the Cadillac!
>
>
>Steve Creswick
>Sr Associate - Balanced Enterprise Solutions
>http://www.linkedin.com/in/stevencreswick
>                         616 834 1883
>
>
>
>
> 
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
>Sent: Monday, January 19, 2015 11:22 AM
>To: [log in to unmask]
>Subject: [TN] ENEPIG & Gold wire bond
>
>Hi All,
>When wire bonding with 1 mil gold wire is their any difference in wire
>bonding technique on ENEPIG versus electroplated soft gold?
>Thanks. Steve Kelly
>
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