Thanks Steve, I have had one complaint that the nickel is too rough - looks like surface co-planarity is +/- 2 microns which too me is nothing and from further analysis follows the contour of the copper underneath which easily meets the IPC spec - should this cause an issue? Regards Steve On 2015-01-19, 11:56 AM, "Steven Creswick" <[log in to unmask]> wrote: >Steve, > >The short answer is not too much. > >You should be able to develop a robust bond schedule to the ENEPIG (but I >guarantee you that it will be at least somewhat different than your bond >schedule to soft gold). Under no circumstances should you assume that it >is >a plug and play alternate. > >You should not have to spec any differences in wire properties. > >You may look into changing the face angle of your capillary and inner >chamfer as part of your qualification testing. Depending upon your >current >bonding tool, you may also take a look at increasing the outer radius of >the >tool. > >ENEPIG is 'hard' in comparison to pure soft gold, so if currently running >with a 15° face angle, look at 8°. If you have problems with tail >formation, you may look into a 120° inner chamfer instead of a 90°. If >you >are getting a lot of heel breaks at the second bond, increase the outer >radius ..... all stuff you most likely are already looking into. > >Final comments - ENEPIG is not totally without issues. Some days, some >lots, just plain sucked! There is no other way to say it. Get a reliable >plater. Work with them. Stay with them. Don't let accounting take you >to >the cheapest place in town - you will regret the grief you will have. > >NOTHING bonds like clean, pure, soft gold!!! It IS the Cadillac! > > >Steve Creswick >Sr Associate - Balanced Enterprise Solutions >http://www.linkedin.com/in/stevencreswick > 616 834 1883 > > > > > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly >Sent: Monday, January 19, 2015 11:22 AM >To: [log in to unmask] >Subject: [TN] ENEPIG & Gold wire bond > >Hi All, >When wire bonding with 1 mil gold wire is their any difference in wire >bonding technique on ENEPIG versus electroplated soft gold? >Thanks. Steve Kelly > >______________________________________________________________________ >This email has been scanned by the Symantec Email Security.cloud service. >For more information please contact helpdesk at x2960 or [log in to unmask] >______________________________________________________________________ > >______________________________________________________________________ >This email has been scanned by the Symantec Email Security.cloud service. >For more information please contact helpdesk at x2960 or [log in to unmask] >______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________