Fellow TechNetters:

   While some PWB coupons, 1"x1"-0.062 " thickness, were left in the BAKING over for an extended period, 24 hrs., prior to Thermal Stress, Solder Float.   Is there any exposure with processing these sample for cross section.   I realize that if unusual artifacts are visible they could have been induced by the over baking process.   I need your input.

Victor,


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