Fellow TechNetters: While some PWB coupons, 1"x1"-0.062 " thickness, were left in the BAKING over for an extended period, 24 hrs., prior to Thermal Stress, Solder Float. Is there any exposure with processing these sample for cross section. I realize that if unusual artifacts are visible they could have been induced by the over baking process. I need your input. Victor, ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________